Basic concept of pcb multilayer board

PCB multi-layer board refers to the multi-layer circuit board used in electrical products, and the multi-layer board uses more single-sided or double-sided wiring boards. A printed circuit board with one double-sided inner layer, two single-sided outer layers, or two double-sided inner layers and two single-sided outer layers, alternated by positioning system and insulating bonding material, and conductive patterns. Printed circuit boards that are interconnected according to design requirements become four-layer and six-layer printed circuit boards, also known as multi-layer printed circuit boards

With the continuous development of SMT (Surface Mount Technology) and the continuous introduction of a new generation of SMD (Surface Mount Devices), such as QFP, QFN, CSP, BGA (especially MBGA), electronic products are made more intelligent and miniaturized, so It has promoted the major reform and progress of PCB industry technology. Since IBM first successfully developed a high-density multilayer board (SLC) in 1991, major groups in various countries have also successively developed a variety of high-density interconnect (HDI) microplates. The rapid development of these processing technologies has prompted the PCB design to gradually develop in the direction of multi-layer and high-density wiring. Multilayer printed boards have been widely used in the production of electronic products due to their flexible design, stable and reliable electrical performance and superior economic performance.